advanced power n-channel enhancement mode electronics corp. power mosfet low on-resistance bv dss 30v simple drive requirement r ds(on) 6.5m fast switching characteristic i d 16a description absolute maximum ratings symbol units v ds v v gs v i d @t a =25 a i d @t a =70 a i dm a p d @t a =25 w t stg t j symbol value unit rthj-a maximum thermal resistance, junction-ambient 3 50 /w data and specifications subject to change without notice 200812181 1 AP9414GM rating 30 + 20 16 parameter drain-source voltage gate-source voltage continuous drain current 3 storage temperature range continuous drain current 3 12.8 pulsed drain current 1 50 rohs-compliant product thermal data parameter total power dissipation 2.5 -55 to 150 operating junction temperature range -55 to 150 advanced power mosfets from apec provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. the so-8 package is widely preferred for commercial-industrial surface mount applications and suited for low voltage applications such as dc/dc converters. s s s g d d d d so-8 g d s
electrical characteristics@t j =25 o c(unless otherwise specified) symbol parameter test conditions min. typ. max. units bv dss drain-source breakdown voltage v gs =0v, i d =250ua 30 - - v r ds(on) static drain-source on-resistance 2 v gs =10v, i d =15a - - 6.5 m ? ? , ?
AP9414GM fig 1. typical output characteristics fig 2. typical output characteristics fig 3. on-resistance v.s. gate voltage fig 4. normalized on-resistance v.s. junction temperature fi g 5. forward characteristic o f fig 6. gate threshold voltage v.s. reverse diode junction temperature 3 4 5 6 7 8 9 10 246810 v gs , gate-to-source voltage (v) r ds(on) (m ) i d =12a t a =25 : 0 10 20 30 40 50 001122 v ds , drain-to-source voltage (v) i d , drain current (a) t a =25 o c 10 v 7.0 v 6.0 v 5.0 v v g =4.0v 0 10 20 30 40 50 001122 v ds , drain-to-source voltage (v) i d , drain current (a) t a = 150 o c 10 v 7.0 v 6.0 v 5.0 v v g =4.0v 0.4 0.9 1.4 1.9 -50 0 50 100 150 t j , junction temperature ( o c) normalized r ds(on) i d =15a v g =10v 0.0 0.4 0.8 1.2 1.6 -50 0 50 100 150 t j , junction temperature ( o c) normalized v gs(th) (v) 0 4 8 12 16 0 0.2 0.4 0.6 0.8 1 1.2 v sd , source-to-drain voltage (v) i s (a) t j =25 o c t j =150 o c
fig 7. gate charge characteristics fig 8. typical capacitance characteristics fig 9. maximum safe operating area fig 10. effective transient thermal impedance fig 11. switching time waveform fig 12. gate charge waveform 4 AP9414GM q v g 4.5v q gs q gd q g charge 0 2 4 6 8 10 0 102030405060 q g , total gate charge (nc) v gs , gate to source voltage (v) v ds =15v v ds =18v v ds =24v i d =15a 0 1000 2000 3000 4000 1 5 9 1317212529 v ds , drain-to-source voltage (v) c (pf) f =1.0mh z c iss c oss c rss 0.01 0.1 1 10 100 0.01 0.1 1 10 100 v ds , drain-to-source voltage (v) i d (a) t a =25 o c single pulse 100us 1ms 10ms 100ms 1s dc 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1 10 100 1000 t , pulse width (s) normalized thermal response (r thja ) p dm duty factor = t/t peak t j = p dm x r thja + t a r thja =125 o c/w t t 0.02 0.01 0.05 0.1 0.2 duty factor=0.5 single pulse t d(on) t r t d(off) t f v ds v gs 10% 90%
|
